Allocate flow based on thermal difference between a PCB area and t power supply area (with a flow proportion of the power supply area being 5-10%).

Example: The first type is "8 Φ10 holes for large heat dissipation area on PCB & 8 Φ10 holes for small heat dissipation area on PCB & 5 Φ5 holes for power supply area"

Figure 1-1